Intel Accelerates Process and Packaging Innovations

إنتل تسرّع عجلة الابتكار لعمليات تجميع وتغليف المكوّنات الإلكترونية وشرائح المعالجات

Intel Accelerates Process and Packaging Innovations  Annual cadence of innovations drives leadership from silicon to system. NEWS HIGHLIGHTS Roadmap of process and packaging innovations to power next wave of products through 2025 and beyond Two breakthrough process technologies: RibbonFET, Intel’s first new transistor architecture in more than a decade, and PowerVia, an industry-first for backside power delivery Continued leadership in advanced 3D packaging innovations with Foveros Omni and Foveros Direct New node naming to create consistent framework, more accurate view of process nodes for customers and the industry as Intel enters the angstrom era…

 World’s Best Processor for Thin-and-Light Windows Laptops Just Got Better

إنتل تقدم أفضل المعالجات في العالم للحواسيب المحمولة النحيفة

 World’s Best Processor for Thin-and-Light Windows Laptops Just Got Better New 11th Gen Intel  Core processors with Intel Iris Xe graphics, Intel  Wi-Fi 6/6E (Gig+) and Intel 5G Solution power amazing PC experiences from anywhere. What’s New: Today at Computex 2021, Intel announced two new additions to the lineup of 11th Gen Intel® Core™ processors. These new processors, combined with Intel’s co-engineering work with independent software vendors (ISVs) and original equipment manufacturers (OEMs), continue Intel’s leadership in mobile compute — delivering the world’s best processors for thin-and-light Windows on laptops.[1]…